View SA58631_4599195.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

SA58631
3 W BTL audio amplifier
Rev. 02 -- 12 October 2007 Product data sheet
1. General description
The SA58631 is a one channel audio amplifier in an HVSON8 package. It provides power output of 3 W with an 8 load at 9 V supply. The internal circuit is comprised of a BTL (Bridge Tied Load) amplifier with a complementary PNP-NPN output stage and standby/mute logic. The SA58631 is housed in an 8-pin HVSON package which has an exposed die attach paddle enabling reduced thermal resistance and increased power dissipation.
2. Features
I I I I I I I I I Low junction-to-ambient thermal resistance using exposed die attach paddle Gain can be fixed with external resistors from 6 dB to 30 dB Standby mode controlled by CMOS-compatible levels Low standby current < 10 A No switch-on/switch-off plops High power supply ripple rejection: 50 dB minimum ElectroStatic Discharge (ESD) protection Output short circuit to ground protection Thermal shutdown protection
3. Applications
I Professional and amateur mobile radio I Portable consumer products: toys and games I Personal computer remote speakers
NXP Semiconductors
SA58631
3 W BTL audio amplifier
4. Quick reference data
Table 1. Quick reference data VCC = 5 V; Tamb = 25 C; RL = 8 ; f = 1 kHz; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol VCC Iq Istb Po Parameter supply voltage quiescent current standby current output power Conditions operating RL = VMODE = VCC THD+N = 10 % THD+N = 0.5 % THD+N = 10 %; VCC = 9 V THD+N PSRR total harmonic distortion-plus-noise Po = 0.5 W power supply rejection ratio
[2] [3] [1]
Min 2.2 1 0.6 50 40
Typ 9 8 1.2 0.9 3.0 0.15 -
Max 18 12 10 0.3 -
Unit V mA A W W W % dB dB
[1] [2]
With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. Supply voltage ripple rejection is measured at the output with a source impedance of Rs = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. Supply voltage ripple rejection is measured at the output, with a source impedance of Rs = 0 at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail.
[3]
5. Ordering information
Table 2. Type number SA58631TK Ordering information Package Name HVSON8 Description Version plastic thermal enhanced very thin small outline package; SOT909-1 no leads; 8 terminals; body 4 x 4 x 0.85 mm
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
2 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
6. Block diagram
SA58631
IN- IN+ VCC 4 3 6
R R
5
OUT-
20 k
8
OUT+
SVR
2
20 k
MODE
1
STANDBY/MUTE LOGIC 7 GND
002aac005
Fig 1. Block diagram of SA58631
7. Pinning information
7.1 Pinning
terminal 1 index area MODE SVR IN+ IN- 1 2 8 7 OUT+ GND VCC OUT-
SA58631TK
3 4 6 5
002aac006
Transparent top view
Fig 2. Pin configuration for HVSON8
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
3 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
7.2 Pin description
Table 3. Symbol MODE SVR IN+ IN- OUT- VCC GND OUT+ Pin description Pin 1 2 3 4 5 6 7 8 Description operating mode select (standby, mute, operating) half supply voltage, decoupling ripple rejection positive input negative input negative output terminal supply voltage ground positive output terminal
8. Functional description
The SA58631 is a single-channel BTL audio amplifier capable of delivering 3 W output power to an 8 load at THD+N = 10 % using a 9 V power supply. Using the MODE pin, the device can be switched to standby and mute condition. The device is protected by an internal thermal shutdown protection mechanism. The gain can be set within a range of 6 dB to 30 dB by external feedback resistors.
8.1 Power amplifier
The power amplifier is a Bridge Tied Load (BTL) amplifier with a complementary PNP-NPN output stage. The voltage loss on the positive supply line is the saturation voltage of a PNP power transistor, on the negative side the saturation voltage of an NPN power transistor. The total voltage loss is < 1 V. With a supply voltage of 9 V and an 8 loudspeaker, an output power of 3 W can be delivered to the load.
8.2 Mode select pin (MODE)
The device is in Standby mode (with a very low current consumption) if the voltage at the MODE pin is greater than VCC - 0.5 V, or if this pin is floating. At a MODE voltage in the range between 1.5 V and VCC - 1.5 V the amplifier is in a mute condition. The mute condition is useful to suppress plop noise at the output, caused by charging of the input capacitor.
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
4 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
9. Limiting values
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC VI IORM Tstg Tamb VP(sc) Ptot
[1]
Conditions operating
Min -0.3 -0.3 -
Max +18 VCC + 0.3 1 +150 +85 10 2.3
Unit V V A C C V W
supply voltage input voltage repetitive peak output current storage temperature ambient temperature short-circuit supply voltage total power dissipation
AC and DC short-circuit safe voltage.
non-operating operating
[1]
-55 -40 -
HVSON8
10. Thermal characteristics
Table 5. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions free air 9.7 cm2 (1.5 in2) heat spreader 32 cm2 (5 in2) heat spreader Rth(j-sp)
[1]
[1]
Typ 80 32 28 5
Unit K/W K/W K/W K/W
[1]
thermal resistance from junction to solder point
Thermal resistance is 28 K/W with DAP soldered to 32 cm2 (5 in2), 35 m copper (1 ounce copper) heat spreader.
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
5 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
11. Static characteristics
Table 6. Static characteristics VCC = 5 V; Tamb = 25 C; RL = 8 ; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol VCC Iq Istb VO VO(offset) IIB(IN+) IIB(IN-) VMODE Parameter supply voltage quiescent current standby current output voltage differential output voltage offset input bias current on pin IN+ input bias current on pin IN- voltage on pin MODE operating mute standby IMODE
[1] [2]
Conditions operating RL = VMODE = VCC
[2] [1]
Min 2.2 0 1.5 VCC - 0.5 -
Typ 9 8 2.2 -
Max 18 12 10 50 500 500 0.5 VCC - 1.5 VCC 20
Unit V mA A V mV nA nA V V V A
current on pin MODE
0 V < VMODE < VCC
With a load connected at the outputs the quiescent current will increase, the maximum of this increase being equal to the DC output offset voltage divided by RL. The DC output voltage with respect to ground is approximately 0.5 x VCC.
12. Dynamic characteristics
Table 7. Dynamic characteristics VCC = 5 V; Tamb = 25 C; RL = 8 ; f = 1 kHz; VMODE = 0 V; measured in test circuit Figure 3; unless otherwise specified. Symbol Po Parameter output power Conditions THD+N = 10 % THD+N = 0.5 % THD+N = 10 %; VCC = 9 V THD+N Gv(cl) Zi Vn(o) PSRR Vo
[1] [2] [3] [4] [5]
Min 1 0.6 [1]
Typ 1.2 0.9 3.0 0.15 100 -
Max 0.3 30 100 200
Unit W W W % dB k V dB dB V
total harmonic distortion-plus-noise closed-loop voltage gain differential input impedance noise output voltage power supply rejection ratio output voltage
Po = 0.5 W
6 -
[2] [3] [4]
50 40 -
mute condition
[5]
Gain of the amplifier is 2 x (R2 / R1) in test circuit of Figure 3. The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz (unweighted), with a source impedance of RS = 0 at the input. Supply voltage ripple rejection is measured at the output with a source impedance of Rs = 0 at the input. The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. Supply voltage ripple rejection is measured at the output, with a source impedance of Rs = 0 at the input. The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV (RMS), which is applied to the positive supply rail. Output voltage in mute position is measured with an input voltage of 1 V (RMS) in a bandwidth of 20 kHz, which includes noise.
(c) NXP B.V. 2007. All rights reserved.
SA58631_2
Product data sheet
Rev. 02 -- 12 October 2007
6 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
13. Application information
C1 1 F
R1 11 k
R2 56 k
VCC IN- IN+ 4 3 6 5 OUT-
RL 100 nF 100 F
VI
SVR MODE C2 47 F
SA58631
2 8 1 7 GND OUT+
002aac007
R2 Gain = 2 x -----R1 Fig 3. Application diagram of SA58631 BTL differential output configuration
14. Test information
14.1 Test conditions
The junction to ambient thermal resistance, Rth(j-a) = 27.7 K/W for the HVSON8 package when the exposed die attach paddle is soldered to 32 cm2 (5 in2) area of 35 m (1 ounce) copper heat spreader on the demo PCB. The maximum sine wave power dissipation for Tamb = 25 C is: 150 - 25 -------------------- = 4.5 W 27.7 Thus, for Tamb = +85 C the maximum total power dissipation is: 150 - 85 -------------------- = 2.35 W 27.7 The power dissipation versus ambient temperature curve (Figure 5) shows the power derating profiles with ambient temperature for three sizes of heat spreaders. For a more modest heat spreader using 9.7 cm2 (1.5 in2) area on the top side of the PCB, the Rth(j-a) is 31.25 K/W. When the package is not soldered to a heat spreader, the Rth(j-a) increases to 83.3 K/W.
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
7 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
6.0 Po (W) 4.0 RL = 8
002aac008
5.0 P (W) 4.0
002aac009
(3) (2)
3.0 16 2.0 1.0
2.0
(1)
0 0 5.0 10.0 15.0 VCC (V) 20.0
0 0 50 100 Tamb (C) 150
(1) No heat spreader. (2) Top only heat spreader (9.7 cm2 (1.5 in2), 35 m (1 ounce) copper). (3) Both top and bottom heat spreader (approximately 32 cm2 (5 in2), 35 m (1 ounce) copper).
Fig 4. Output power versus supply voltage @ THD+N = 10 %; 32 cm2 (5 in2) heat spreader
Fig 5. Power dissipation versus ambient temperature
14.2 BTL application
Tamb = 25 C, VCC = 9 V, f = 1 kHz, RL = 8 , Gv = 20 dB, audio band-pass 20 Hz to 20 kHz. The BTL diagram is shown in Figure 3. The quiescent current has been measured without any load impedance. The total harmonic distortion + noise (THD+N) as a function of frequency was measured with a low-pass filter of 80 kHz. The value of capacitor C2 influences the behavior of PSRR at low frequencies; increasing the value of C2 increases the performance of PSRR. Figure 6 shows three areas: operating, mute and standby. It shows that the DC switching levels of the mute and standby respectively depends on the supply voltage level. The following characterization curves show the room temperature performance for SA58631 using the demo PCB shown in Figure 21. The 8 curves for power dissipation versus output power (Figure 10 through Figure 17) as a function of supply voltage, heat spreader area, load resistance and voltage gain show that there is very little difference in performance with voltage gain; however, there are significant differences with supply voltage and load resistance. The curves for THD+N versus output power (Figure 18) show that the SA58631 yields the best power output using an 8 load at 9 V supply. Under these conditions the part delivers typically 3 W output power for THD+N = 10 %.
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
8 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
16 VMODE (V) 12 standby
002aac042
15 Iq (mA) 10
002aac043
8 mute 5 4
0 0 4 8 12
operating 16 VCC (V)
0 0 4 8 12 16 20 VCC (V)
Fig 6. VMODE versus VCC
-20 SVRR (dB) -40
(1)
Fig 7. Iq versus VCC
002aac044
10 Vo (V) 1 10-1 10-2 10-3 10-4 10-5
(1) (2) (3)
002aac045
-60
(2) (3)
-80 10
102
103
104 f (Hz)
105
10-6 10-1
1
10 VMODE (V)
102
VCC = 5 V; RL = 8 ; Rs = 0 ; VI = 100 mV. (1) Gv = 30 dB (2) Gv = 20 dB (3) Gv = 6 dB
Band-pass = 22 Hz to 22 kHz. (1) VCC = 3 V (2) VCC = 5 V (3) VCC = 12 V
Fig 8. SVRR versus frequency
Fig 9. Vo versus VMODE
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
9 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
5.0 P (W) 4.0 VCC = 9.0 V 3.0 7.5 V
002aac027
5.0 P (W) 4.0 VCC = 9.0 V 3.0 7.5 V
002aac028
2.0 5.0 V 1.0
2.0 5.0 V 1.0
0 0 0.6 1.2 1.8 Po (W) 2.4
0 0 0.6 1.2 1.8 Po (W) 2.4
Fig 10. Power dissipation versus output power; RL = 4.0 ; Gv = 10 dB; 9.7 cm2 (1.5 in2) heat spreader
3.0 P (W) 2.0 VCC = 9.0 V
002aac029
Fig 11. Power dissipation versus output power; RL = 4.0 ; Gv = 20 dB; 9.7 cm2 (1.5 in2) heat spreader
3.0 P (W) 2.0
002aac030
VCC = 9.0 V 7.5 V
7.5 V
1.0
5.0 V
1.0
5.0 V
0 0 1.0 2.0 3.0 Po (W) 4.0
0 0 1.0 2.0 3.0 Po (W) 4.0
Fig 12. Power dissipation versus output power; RL = 8.0 ; Gv = 10 dB; 9.7 cm2 (1.5 in2) heat spreader
002aac031
Fig 13. Power dissipation versus output power; RL = 8.0 ; Gv = 20 dB; 9.7 cm2 (1.5 in2) heat spreader
002aac032
1.6 P (W) 1.2 7.5 V 0.8 VCC = 9.0 V
1.6 P (W) 1.2 7.5 V 0.8 VCC = 9.0 V
0.4
5.0 V
0.4
5.0 V
0 0 1.0 2.0 Po (W) 3.0
0 0 1.0 2.0 Po (W) 3.0
Fig 14. Power dissipation versus output power; RL = 16 ; Gv = 10 dB; 9.7 cm2 (1.5 in2) heat spreader
Fig 15. Power dissipation versus output power; RL = 16 ; Gv = 20 dB; 9.7 cm2 (1.5 in2) heat spreader
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
10 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
3.0 P (W) 2.0 VCC = 9.0 V
002aac033
1.6 P (W) 1.2 VCC = 9.0 V
002aac034
7.5 V 0.8
7.5 V
1.0
5.0 V 0.4
5.0 V
0 0 1.0 2.0 3.0 Po (W) 4.0
0 0 1.0 2.0 Po (W) 3.0
Fig 16. Power dissipation versus output power; RL = 8.0 ; Gv = 20 dB; 32 cm2 (5 in2) heat spreader
Fig 17. Power dissipation versus output power; RL = 16 ; Gv = 20 dB; 32 cm2 (5 in2) heat spreader
102 THD+N (%) 101 VCC = 5.0 V 7.5 V 9.0 V
002aac035
102 THD+N (%) 101 VCC = 5.0 V 7.5 V 9.0 V
002aac036
1
1
10-1
10-1
10-2 10-2
10-1
1 Po (W)
101
10-2 10-2
10-1
1 Po (W)
101
a. f = 1 kHz; RL = 4
102 THD+N (%) 101 VCC = 5.0 V 7.5 V 9.0 V
b. f = 1 kHz; RL = 8
002aac037
1
10-1
10-2 10-2
10-1
1 Po (W)
101
c. f = 1 kHz; RL = 16 Fig 18. THD+N versus output power
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
11 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
2.0 THD+N (%) 1.6
002aac038
1.2 THD+N (%) 0.8
002aac039
1.2
0.8 0.4 0.4
0 10-1
1 f (kHz)
101
0 10-1
1 f (kHz)
101
a. RL = 4
1.0 THD+N (%) 0.8
b. RL = 8
002aac040
0.6
0.4
0.2
0 10-1
1 f (kHz)
101
c. RL = 16 Fig 19. THD+N versus frequency
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
12 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
14.3 Single-ended application
Tamb = 25 C; VCC = 7.5 V; f = 1 kHz; RL = 8 ; Gv = 20 dB; audio band-pass 20 Hz to 20 kHz. The Single-Ended (SE) application diagram is shown in Figure 20.
C1 1 F
R1 11 k
R2 110 k
VCC IN- IN+ 4 3 6 5 OUT-
100 nF C3 470 F RL 100 F
VI
SVR
C2 MODE 47 F
SA58631
2 8 1 7 GND OUT+
002aac041
R2 Gain = -----R1 Fig 20. SE application circuit configuration
The capacitor value of C3 in combination with the load impedance determines the low frequency behavior. The total harmonic distortion + noise as a function of frequency was measured with a low-pass filter of 80 kHz. The value of the capacitor C2 influences the behavior of the PSRR at low frequencies; increasing the value of C2 increases the performance of PSRR.
14.4 General remarks
The frequency characteristics can be adapted by connecting a small capacitor across the feedback resistor. To improve the immunity of HF radiation in radio circuit applications, a small capacitor can be connected in parallel with the feedback resistor (56 k); this creates a low-pass filter.
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
13 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
14.5 SA58631TK PCB demo
The application demo board may be used for evaluation in either BTL or SE configuration as shown in the schematics in Figure 3 and Figure 20. The demo PCB is laid out for the 32 cm2 (5 in2) heat spreader (total of top and bottom heat spreader area).
top layer
bottom layer
GND
VCC/2 GND VCC
SA58631TK
Rev3
6.8 k 6.8 k
MS OUT+
100 F 47 F 1 F P1 100 nF
11 k
INPUT
OUT- VCC GND
002aac047
Fig 21. SA58631TK PCB demo
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
14 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
15. Package outline
HVSON8: plastic thermal enhanced very thin small outline package; no leads; 8 terminals; body 4 x 4 x 0.85 mm
SOT909-1
0
1 scale
2 mm
X D B A
E
A A1 c detail X
terminal 1 index area terminal 1 index area
1
e1 e b
4
v w
M M
CAB C
C y1 C y
L
exposed tie bar (4x)
Eh
8
5
Dh
DIMENSIONS (mm are the original dimensions) UNIT mm A(1) max. 1 A1 0.05 0.00 b 0.4 0.3 c 0.2 D(1) 4.1 3.9 Dh 3.25 2.95 E(1) 4.1 3.9 Eh 2.35 2.05 e 0.8 e1 2.4 L 0.65 0.40 v 0.1 w 0.05 y 0.05 y1 0.1
Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. OUTLINE VERSION SOT909-1 REFERENCES IEC JEDEC MO-229 JEITA EUROPEAN PROJECTION ISSUE DATE 05-09-26 05-09-28
Fig 22. Package outline SOT909-1 (HVSON8)
SA58631_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
15 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
16. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
16.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
16.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering
16.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities
SA58631_2 (c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
16 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
16.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 23) than a PbSn process, thus reducing the process window
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 8 and 9
Table 8. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 9. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 23.
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
17 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 23. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
17. Abbreviations
Table 10. Acronym BTL CMOS DAP ESD NPN PCB PNP RMS THD Abbreviations Description Bridge Tied Load Complementary Metal Oxide Silicon Die Attach Paddle ElectroStatic Discharge Negative-Positive-Negative Printed-Circuit Board Positive-Negative-Positive Root Mean Squared Total Harmonic Distortion
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
18 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
18. Revision history
Table 11. Revision history Release date 20071012 Data sheet status Product data sheet Change notice Supersedes SA58631_1 Document ID SA58631_2 Modifications:
* * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Figure 4: changed incorrect character font Soldering information updated Product data sheet -
SA58631_1
20060308
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
19 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
19. Legal information
19.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
19.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
20. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
SA58631_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 12 October 2007
20 of 21
NXP Semiconductors
SA58631
3 W BTL audio amplifier
21. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 9 10 11 12 13 14 14.1 14.2 14.3 14.4 14.5 15 16 16.1 16.2 16.3 16.4 17 18 19 19.1 19.2 19.3 19.4 20 21 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 4 Mode select pin (MODE) . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 Application information. . . . . . . . . . . . . . . . . . . 7 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 7 Test conditions . . . . . . . . . . . . . . . . . . . . . . . . . 7 BTL application . . . . . . . . . . . . . . . . . . . . . . . . . 8 Single-ended application . . . . . . . . . . . . . . . . 13 General remarks . . . . . . . . . . . . . . . . . . . . . . . 13 SA58631TK PCB demo . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Introduction to soldering . . . . . . . . . . . . . . . . . 16 Wave and reflow soldering . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 17 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Legal information. . . . . . . . . . . . . . . . . . . . . . . 20 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 October 2007 Document identifier: SA58631_2

▲Up To Search▲

Price & Availability of SA58631

	To Download SA58631 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .